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  hi-sincerity microelectronics corp. spec. no. : hl200901 issued date : 2009.02.13 revised date :2009.08.0 page no. : 1/3 hsb320 thru HSB3100 hsmc product specification hsb320 thru HSB3100 do-15 schottky barrier rectifiers (reverse voltage 20 to 100v, forward current 3a) features ? low forward voltage drop ? high current capability ? high reliability ? high surge current capability mechanical data ? cases: do-15 molded plastic body ? epoxy: ul 94v-0 rate flame retardant ? lead: axial leads, solderable per mil-std-202, method 208 guaranteed ? polarity: color band denotes cathode end ? high temperature soldering guaranteed: 250 c/10seconds/.375?(9.5mm) lead lengths at 5lbs.(2.3kg) tension ? weight: 0.4gram maximum ratings & electrical characteristics ratings at 25 c ambient temperature unles s otherwise specified. single phase, half wave, 60 hz, resistive or inductive load. for capacitive load. derate current by 20%. ratings symbol hsb 320 hsb 330 hsb 340 hsb 350 hsb 360 hsb 380 hsb 3100 unit repetitive peak reverse voltage v rrm 20 30 40 50 60 80 100 v surge peak reverse voltage v rsm 14 21 28 35 42 57 71 v dc blocking voltage v dc 20 30 40 50 60 80 100 v average forward rectified current (t a =75 o c) i fav 3 a peak forward surge current, 50hz half sine-wave (t a =25 o c) i fsm 80 a repetitive peak forward c (f>15hz) i frm 12 a instantaneous forward voltage v f 0.48 0.52 0.7 0.8 v leakage current (t j =25 o c, v r =v rrm ) 0.1 ma leakage current (t j =100 o c, v r =v rrm ) i r 20 ma typical junction capacitance c j 170 pf rating for fusing, t<10ms (t a =25 o c) i 2 t 12.5 a 2 s thermal resistance junction to ambient air r ja 50 c/w thermal resistance junction to lead r jl 15 c/w operating junction temperature range t j -65 to +125 c storage temperature range t stg -65 to +150 c esd protection voltage v esd <8 kv
hi-sincerity microelectronics corp. spec. no. : hl200901 issued date : 2009.02.13 revised date :2009.08.0 page no. : 2/3 hsb320 thru HSB3100 hsmc product specification characteristics curve 0 25 50 75 100 125 150 175 0 1 2 3 4 forward current derating curve lead temperature ( o c) average forward current (a) resistive or inductive load 0.375? (9.5mm) lead length 0 20 40 60 80 maximum non-repetitive peak forward surge current 100 1 10 100 number of cycles at 60hz peak forward surge current (a) t j =t j max. 8.3ms single half sine-wave (jedec method) 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.01 0.1 1 10 50 instantaneous forward voltage (v) instantaneous forward current (a) typical instantaneous forward characteristics t j =125 o c t j =25 o c pulse width=300us 1% duty cycle 0 20 40 60 80 100 percent of rated peak reverse voltage (%) 0.001 0.01 0.1 1 10 instantaneous reverse current (ma) typical reverse characteristics t j =125 o c t j =75 o c t j =25 o c 0 1 10 100 reverse voltage (v) 10 100 1000 junction capacitance (pf) typical junction capacitance t j =25 o c, f=1mhz v sig =50mvp-p 0 0.1 1 10 100 t, pulse duration (sec.) 0.1 1 10 100 typical transient thermal impedance transient thermal impedance ( o c/w)
hi-sincerity microelectronics corp. spec. no. : hl200901 issued date : 2009.02.13 revised date :2009.08.0 page no. : 3/3 hsb320 thru HSB3100 hsmc product specification do-15 dimension important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of hsmc. ? hsmc reserves the right to make changes to its products without notice. ? hsmc semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? hsmc assumes no liability for any consequenc e of customer product design, infringement of patents, or application assistance. head office and factory: ? head office (hi-sincerity microelectronics corp.): 10f.,no. 61, sec. 2, chung-shan n. rd. taipei taiwan r.o.c. tel: 886-2-25212056 fax: 886-2-25632712 marking: marking around the surface of cylinder date code control code hsb 3 product series 20,30,40,50,60,80,100 pb free mark pb-free: " . " (note) normal: none note: green label is used for pb-free packing 2-lead do-15 molded plastic package hsmc package code: l e b c a d dim min. max. a 0.70 0.90 b 25.40 - c 5.80 7.60 d 25.40 - e 2.60 3.60 unit: mm


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